Siemens digital industrial software recently announced that it has joined the EDA alliance as a chartered member of Intel wafer foundry service (IFS) acceleration plan. Intel’s IFS program is committed to establishing a complete ecosystem and providing design and manufacturing support for the next generation chip level system (SOC) based on IFS’s leading process technology.

The program aims to promote cooperation between ifs and its ecosystem partners, focusing on reducing risks and removing design barriers, while accelerating product time to market for common customers. Partners in the EDA alliance of IFS acceleration program can obtain Intel process and packaging technology in advance, and jointly optimize and improve tools and processes to give full play to Intel’s technical capabilities.
Rahul Goyal, vice president and general manager of Intel product and design ecosystem support, said: “IFS ecosystem alliance is an important step towards Intel’s vision in the field of wafer foundry, and we are very pleased that Siemens EDA can join this program. Siemens’ excellent EDA products, coupled with IFS’s leading process technology, will provide design teams in the whole industry with solutions that meet their needs and help them stand in today’s competitive IC market.”
As a member of the alliance, Siemens will work closely with IFS to continuously optimize IC design tools, processes and methods for Intel’s advanced processes. The first batch of Siemens EDA products certified by IFS include the industry-leading calibre ®  Nm platform and analog fastspice (AFS) platform, in which AFS platform can provide advanced circuit verification functions for nano analog, radio frequency (RF), mixed signals, memory and customized digital circuits.
Joe Sawicki, executive vice president of Siemens digital industrial software ic-eda, said: “Semiconductors are playing an increasingly important role in the global economy. IFS represents Intel’s commitment to the foundry market and brings new impetus to product innovation. We are very honored to cooperate with IFS to provide optimized software solutions to help our mutual customers make full use of Intel’s process and packaging technology to realize innovation.”